Chemlease PMR EZ Release Agent is a semi‑permanent mould release for composites. Wipe-on application creates an invisible, micro‑thin film for multiple releases, excellent gloss and minimal transfer – without mould build‑up. Helps eliminate wax and reduce labour and costs. Works with polyester, vinyl ester, epoxy, phenolic, DCPD and BMI resins. High temperature stability for demanding cycles in use.
Chemlease PMR EZ Release Agent is used in composite moulding applications where a high‑quality, high‑gloss finish is required, forming a durable semi‑permanent release film on the mould surface. It performs well across a wide range of common composite resin systems – polyester, vinyl ester, DCPD, phenolic, epoxy and BMI – making it suitable for many tooling and production environments where consistent release and surface quality are critical. Because it’s designed to deliver multiple releases between applications and maintain performance under high temperature conditions, it’s particularly useful for repeat cycles in demanding composite manufacturing workflows.
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FEATURE
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DESCRIPTION
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Semi‑Permanent System for High‑Quality Composite Finishes
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Designed as a semi‑permanent release system for composite moulding where a high‑quality finish is required.
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Excellent Gloss Results
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Supports premium surface finish expectations by delivering excellent gloss on moulded parts.
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Easy Wipe‑On Application (No Wax Needed)
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Simple wipe‑on process that eliminates the need for wax and supports reduced labour time and overall costs.
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Multiple Releases Between Applications
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Helps extend production runs by delivering multiple releases before reapplication is needed.
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Broad Resin Compatibility
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Performs well with common moulding resins including polyester, vinyl ester, DCPD, phenolic, epoxy and BMI.
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Invisible Micro‑Thin Film (No Build‑Up, Minimal Transfer)
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Forms an invisible, micro‑thin release film engineered to avoid mould surface build‑up while keeping transfer to parts minimal.
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HAPs‑Free* Formulation Notes & No Class I/II ODS Solvent Carriers
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HAPs are not formula constituents, and the solvent carriers contain no Class I/II ozone‑depleting substances.
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High Temperature Stability
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Provides high temperature stability, with the release film reported to tolerate very high heat (in excess of 400°C / 750°F).
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*HAPs are not formula constituents of this product. Standard manufacturing processes may result in trace quantities [<0 .1%] of HAPs. Please view TDS for more information.
This product is available in a variety of packaging sizes. Please contact our customer support team for details.
